The 2018 Joint IEEE International Symposium on Electromagnetic Compatibility & Asia-Pacific Symposium on Electromagnetic Compatibility (2018 Joint IEEE EMC & APEMC) was successfully held in the Singapore Conference Center from 14 May to 17 2018. The conference was jointly organized by Zhejiang University and the IEEE Electromagnetic Compatibility Society in collaboration with National University of Singapore. Professor Li Erping served as the President of the conference. The theme of this conference is discussion of 5G communication and high-speed chip electromagnetic compatibility research.
The IEEE EMC is the most prestigious academic conference in the field of international electromagnetic compatibility. It has been held in Europe and America for 59 sessions (58 sessions in North America and 1 session in Germany). This was the first time that the international conference was held in Asia. The symposium was jointly organized by the IEEE EMC Society and the APEMC. More than 680 representatives of universities, research institutions and companies from 32 countries and regions including China, Japan, the United States, Singapore, South Korea, Germany, France, and the United Kingdom attended the conference. The conference received a total of more than 500 academic papers and accepted 392 papers, which fully demonstrated the latest developments in the field of electromagnetic compatibility and the signal integrity and power integrity of high-speed circuits. The conference gathered most professional experts in the field of electromagnetic compatibility in the world, including several IEEE Fellows, Academician of the German Academy of Sciences, Academician of the American Academy of Engineering, Academician of the Royal Canadian Academy of Engineering, etc. Dr. Mark Hayter, Chief Scientist of Google, Dr. Wolfgang JR Hoefer of the Victoria University of Canada, Academician of the German Academy of Science and Engineering, Prof. Weng Cho Chew of the Purdue University, Academician of the American Academy of Engineering, and Professor Yueping Zhang of Nanyang Technological University, IEEE Fellow, gave Plenary Talks respectively. IEEE Fellow Professor Li Erpin made a report on the development of Asia-Pacific electromagnetic compatibility at the opening ceremony of the conference. Scientists and engineers from internationally renowned companies such as Intel, Huawei, Samsung, and Google shared their achievements and challenges in EMC research and design. At this conference, the IEEE EMC Society presented the APEMC Founder President Award to Prof. Li Erping for his outstanding contribution to the field of electromagnetic compatibility in the Asia-Pacific region.
392 papers were presented to the delegates in the form of oral presentations and posters. The topics cover 5G communication electromagnetic compatibility issues, semiconductor device and chip electromagnetic compatibility, signal and power integrity, smart grid electromagnetic compatibility, bio-electromagnetics, wireless energy transmission, electrostatic simulation and protection, electromagnetic environment and testing, electromagnetic specifications and standards, lightning protection, antenna and transmission, electromagnetic information leak and countering, system and electromagnetic compatibility, computational simulation and test of electromagnetic compatibility, Nano Electromagnetic Compatibility, etc. .
After the conference, the international representatives and renowned experts spoke highly of the symposium: The academic level of the symposium was considerably high, and the review of the paper was extremely strict and it’s a successfully organized IEEE EMC.
Prof. Li Erping giving report on the symposium
The conference hall of 2018 IEEE EMC
Dr. Bruce Amchambeault (on the right), General Chair of IEEE EMC Society, awarding Prof. Li Erping with APEMC Founder President Award
Mark Hayter, Chief Scientist of Google, making report named ‘Chromebooks, USB-C and Google SI/PI Research’
Dr. Wolfgang JR Hoefer of the Victoria University of Canada, Academician of the German Academy of Science and Engineering, delivering Plenary Talk
Prof. Weng Cho Chew of the Purdue University, Academician of the American Academy of Engineering, delivering Plenary Talk named ‘Marriage of Computational Electromagnetics and Electromagnetic Compatibility’
Professor Yueping Zhang of Nanyang Technological University, IEEE Fellow, delivering Plenary Talk named ‘Wireless Chip Area Netwrok a New paradigm for RF microelectronics and Radio Communications’
A doctoral student Zuo Panpan under instruction of Prof. Li Erping (first from right), won the Best Student Paper Award, and Dr. Bruce Amchambeault (first from the left), the General Chair of IEEE EMC Society, awarded the “IEEE Best Electromagnetic Compatibility Student Paper” award certificate. The second from left is Dr. Zhang Yaojiang, Huawei’s chief Scientist, awarding her a premium.
Photo of Prof. Li Erping and student delegates under his instruction
